NVIDIA® Jetson™ AI Camera Platform (145 x 64.5mm)

  • Description
  • Specifications
  • Ordering Guide

Photon is a Jetson™ AI Camera Platform specifically designed to support smart camera applications. This Jetson™ platform provides PoE PD Gigabit Ethernet uplink for data and power and has various I/O connectors positioned for easy packaging into off the shelf camera housings.  For applications that don’t require PoE PD ask for our lower cost Non-PoE PD options.

Compatibility NVIDIA® Nano
NVIDIA® Jetson Xavier NX
Front IO (Camera End) USB 1x USB 3.0 (Connector: USB Type-C)
Front IO (Camera End) MIPI Camera Inputs 2x 2-lane MIPI CSI-2
15-pin FPC 1mm Pitch Connector
Same MIPI connector used on Nano Dev Kit
Front IO (Camera End) Camera MISC Interface 1x I2C (Can be used for Lens Control)
4x GPIO (Can be used for Additional Camera Control)
1x Power Output (Can be used for IR LEDs)
Internal IO Display Output 1x HDMI (Type-A Vertical)
Internal IO Fan 1x 4-pin PWM Fan Connector
Rear IO – Ethernet 1x 1000BASE-T Uplink
PoE IEEE 802.3af-2003 (15.4W) PD
Capable of operating on either network
Lower-cost PoE Bypass Option Available
1x USB 2.0 OTG for Flashing Capability (Micro USB)
Rear IO – USB OTG 1x USB 2.0 OTG for Flashing Capability (Micro USB)
Rear IO – Power Input 1x 2mm DC Barrel Jack
+12V DC Input
Rear IO – User Feedback 1x RGB LED
I2C controlled
Storage 1x SD Card Slot
1x NVMe (M.2 M-KEY)
Wireless Expansion 1x WiFi Module (M.2 2230 E-KEY)
1x LTE Module (M.2 2242 B-KEY) w/ SIM Card Slot
Dimensions 145 x 64.5mm
Operating Temperature -25°C to +85°C


Model Description
NGX002 Photon AI Camera Platform, multi camera input, GbE, PoE uplink
NGX003 Photon AI Camera Platform, multi camera input, GbE, no PoE
XHG308 NVIDIA® Jetson Nano™ Passive Heat Sink
XHG309 NVIDIA® Jetson Nano™ Active Heat Sink
XHG310 NVIDIA® Jetson Nano™ Thermal Transfer Plate
XHG311 NVIDIA® Jetson Xavier™ NX Passive Heat Sink
XHG312 NVIDIA® Jetson Xavier™ NX Active Heat Sink
XHG313 NVIDIA® Jetson Xavier™ NX Thermal Transfer Plate