Extreme Rugged™ Coldplate mount Gen3 Intel® Core™ i7 system

  • Description
  • Specifications
  • Ordering Guide
  • Optional Accessories

The HPERC-IBR-HC is SWaP efficient sealed SFF System. Inside the tiny footprint of HPERC™ lives the power of 3rd generation Intel® Core™ i7 processor and optional GPGPU parallel processing engine. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.

Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC™ reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. Built with proven Ampro reliability, the rugged capabilities of HPERC™ are ideal for ground, air and sea deployments.

HPERC™ systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.

Processor Intel® Core™ i7-3517UE 1.7-GHz, Dual Core
Intel® Core™ i7-3612QE 2.1-GHz, Quad Core
Chipset Intel® QM77 Express Chipset
GP-GPU MXM NVIDIA GT 745M with 2GB 128-bit GDDR5 (Optional)
Main Memory 16-GB DDR3L-1333 ECC
8-GB soldered down, 8-GB SODIMM
Graphics 1x HDMI
1x VGA
2x DVI
(only 2 display outputs supported concurrently)
Storage 2x removable 2.5” SLC SSD on SATA 6 Gb/s (Up to 1-TB)
Supports RAID 0/1
Removable 1x SDHC – SLC (Up to 64-GB)
Ethernet 4x Intel® I210 Gigabit Ethernet controller
USB 2x USB 3.0
4x USB 2.0
Serial 7x RS-232/422
Audio 1x Amplified Stereo output
1x stereo input
Expansion MXM (3rd Generation x16 PCIe)
PCI/104 Express® Type II (Gen2 PCIe)
PCI Express Mini Card (Gen2 PCIe)
Security Atmel AT97SC3204-U1A190
Hardware or software triggered secure erase
Connectors MIL-DTL-38999 (uniquely-keyed)
Power Input +10 ~ +36VDC
Dimensions (LWH) 223.65 x 177.8 x 68.7 mm (with mounting brackets)
Operating Temperature -40 to +85°C (i7-3517UE)
-40 ~ +80°C  (i7-3612QE)
MIL-STD-810G – 501.5 Procedure II, Method 1 and 3
MIL-STD-810G – 502.5, Procedure 1 and 2
Weight 3.12-kg
OS Supported Windows® 7 (64-bit)
WES7 (64-bit/32-bit)
Vx Works
Humidity 95% at 60°C non-condensing
Immersion IEC 529 – IP-67
Shock MIL-STD-810G – 516.6 Procedures I and V
Vibration MIL-STD-810G – 514.6 Procedure I
Categories 4, 9, 11, 21
Model Description
HPERC-IBRHC-100XN Coldplate, Intel® Core™ i7 3517UE, 16GB RAM
HPERC-IBRHC-B00XN Coldplate,  Intel® CoreTM i7 3612QE, 16GB RAM
HPERC-IBRHC-300XN Coldplate,  Intel® CoreTM i7 3517UE, 8GB RAM
HPERC-IBRHC-D00XN Coldplate,  Intel® CoreTM i7 3612QE, 8GB RAM
Model Description
HPERC-H-03 HPERC™ breakout cable kit including MERITEC MIL-STD Nkey & Akey and AC adapter
M3N745M-JN-A MXM NVIDIA® GT 745M GPU card, with 2GB 128-bit GDDR5 memory
(must be pre-assembled at factory)