HPERC-IBR-MC

Extreme Rugged™ Coldplate mount Gen3 Intel® Core™ i7 system

  • Description
  • Specifications
  • Ordering Guide
  • Optional Accessories

The HPERC-IBR-MC is SWaP efficient sealed SFF System based on Intel® Gen3 Core™ i7 processor.  It is designed for embedded application that requires long life-cycles,
configuration control, and ruggedness in hardened military packages.

It supports up to 16-GB of DDR3 ECC memory and features dual removable secure erase RAID-0 SSDs with 12Gb/s throughput.  A wide array of IOs are supported via uniquely-keyed MIL-DTL-38999 connectors making it suitable for deployment in extreme hostile environments.

The HPERC-IBR-MC is also capable of supporting an optional GP-GPU via the MXM socket.  PCI/104e and mini-PCIe sockets are also available for furthe

Processor Intel® Core™ i7-3517UE 1.7-GHz, Dual Core
Intel® Core™ i7-3612QE 2.1-GHz, Quad Core
Chipset Intel® QM77 Express Chipset
GP-GPU MXM NVIDIA GT 745M with 2GB 128-bit GDDR5 (Optional)
Main Memory 16-GB DDR3L-1333 ECC
8-GB soldered down, 8-GB SODIMM
Graphics 1x VGA
2x DVI
(only 2 display outputs supported concurrently)
Storage 2x removable 2.5” SLC SSD on SATA 6 Gb/s (Up to 1-TB)
Supports RAID 0/1
Removable 1x SDHC – SLC (Up to 64-GB)
Ethernet 4x Intel® I210 Gigabit Ethernet controller
USB 6x USB 2.0
Serial 7x RS-232/422
Audio 1x Amplified Stereo output
1x stereo input
Expansion MXM (3rd Generation x16 PCIe)
PCI/104 Express® Type II (Gen2 PCIe)
PCI Express Mini Card (Gen2 PCIe)
Security Atmel AT97SC3204-U1A190
Software triggered secure erase
Connectors MIL-DTL-38999 (uniquely-keyed)
Power Input +10 ~ +36VDC
Dimensions (LWH) 223.65 x 177.8 x 68.7 mm (with mounting brackets)
Operating Temperature -40 to +85°C (i7-3517UE)
-40 ~ +80°C  (i7-3612QE)
MIL-STD-810G – 501.5 Procedure II, Method 1 and 3
MIL-STD-810G – 502.5, Procedure 1 and 2
Weight 3.12-kg
OS Supported Windows® 7 (64-bit)
WES 7 (64-bit/32-bit)
Vx Works 6.9.3.1
Humidity 95% at 60°C non-condensing
Immersion IEC 529 – IP-67
Shock MIL-STD-810G – 516.6 Procedures I and V
Vibration MIL-STD-810G – 514.6 Procedure I
Categories 4, 9, 11, 21
EMI/EMC MIL-STD-461F
Model Description
HPERC-IBRMC-100XN Coldplate, Intel® Core™ i7 3517UE, 16GB RAM
HPERC-IBRMC-300XN Coldplate, CoreTM i7 3612QE, 16GB RAM
HPERC-IBRMC-B00XN Coldplate, CoreTM i7 3517UE, 8GB RAM
HPERC-IBRMC-D00XN Coldplate, CoreTM i7 3612QE, 8GB RAM
Model Description
HPERC-X-03 HPERC™ breakout cable kit including Amphenol
MIL-STD Nkey & Akey and AC adapter
M3N745M-JN-A MXM NVIDIA® GT 745M GPU card, with 2GB 128-bit GDDR5 memory
(must be pre-assembled at factory)